Depaneling applications Odd-form Placement applications Laser applications Dispensing applications Semi-conductor applications
2300LC HTCC LTCC_480x355
2300LC HTCC LTCC_480x355
2300LC HTCC LTCC_3_480x355
2300LC HTCC LTCC_4_480x355
2300LC HTCC LTCC_5_480x355
Product Description
Cencorp 2300LC is mainly used for laser scribing, cutting and drilling of Al2O3, AlN and other ceramic materials.
Advantages
High Quality Cutting Effect
Imported QCW fiber laser+fiber cutting head or imported CO2 laser+CO2 cutting head are used;
The laser system has good beam quality and fine focusing spot to ensure good processing effect;
The cutting platform adopts high-pre
Technical Parameter


2300LC HTCC LTCC td_EN.jpg