Semi-conductor - Cases - Cencorp (Zhuhai) Industrial Technology Co., Ltd.

Semi-conductor

Based on self-developed motion controllers, combined with pick and place technology, laser technology and vision algorithms, cencorp provides customers with mature semiconductor sorting equipment, laser processing equipment and various types of inspection/testing equipment in the field of semiconductor packaging and testing.

Wafer Dicing/Grooving Machine (1700LC)

Wafer coating system, Autofocus system, Visual positioning system, Laser dicing system, Cleaning system and Loading and unloading system

cencorp 1700LC is a fully automatic laser wafer dicing machine suitable for applications such as Si-based wafer dicing, sapphire surface grooving, and Low-K layer grooving. Support 8-inch, 12-inch wafers, automatic focus, fully automatic production. Product Composition: Wafer coating system, Autofocus system, Visual positioning system, Laser dicing system, Cleaning system and Loading and unloading system
Optoelectronic Chip 4-sided Inspection & Sorting Equipment(1500AD)

Automatic loading and unloading module+Autofocus module+High precision optical inspection module

For the semiconductor industry optical chip production process product appearance defect detection. Minimum product size:100um*100um*75um Product Composition: Automatic loading and unloading module+Autofocus module+High precision optical inspection module