Product Description
Cencorp 780 D integrates various dispensing technologies and provides a variety of automatic dispensing solutions. It is the best choice in application with complex dispensing path requirement. 780D is mainly used in hot melt adhesive, bottom bonding, surface mount, stack packaging, dam filling, electronic component bonding and material reinforcement in the consumer electronics industry.
Advantages
High cost-effective
Integrated rack design, stable structure, short downtime and more efficient system operation
The use of international top components reduces the failure rate
Fewer wearing parts, saving the cost
Flexibility
In-line automatic dispensi
