Cencorp 780 D integrates various dispensing technologies and provides a variety of automatic dispensing solutions. It is the best choice in application with complex dispensing path requirement. 780D is mainly used in hot melt adhesive, bottom bonding, surface mount, stack packaging, dam filling, electronic component bonding and material reinforcement in the consumer electronics industry.

Be used for edge sealing dispensing/coating process of large automative dimming film (PDLC/LC/SPD etc.), be suitable for epoxy/UV glue types/silver paste. Can be expanded for silver paste coating process, with a minimum coating thickness of 20-30μm. The marble platform, linear motor module, and integrated high-rigidity frame design are used to ensure the accuracy and stability during equipment motion processing. The machine achieve offline production by manual loading and unloading, and can be equipped with a robot module to provide an online automated production solution.

Online high precision&speed despensers which use full set automation solutions, they widely used in electronic engineering, medical treatment, optics and relveant to various production line operations because of its characteristics of high-effiency, intellgent and high precision.