Product Description
cencorp 1700LC is a fully automatic laser wafer dicing machine suitable for applications such as Si-based wafer dicing, sapphire surface grooving, and Low-K layer grooving.
Support 8-inch, 12-inch wafers, automatic focus, fully automatic production.
Product Composition: Wafer coating system, Autofocus system, Visual positioning system, Laser dicing system, Cleaning system and Loading and unloading system
Advantages
High speed & high precision motion control
Independent research and development of optical path system
Realize closed-loop control of optical output power, beam shaping, controllable aperture, end beam quality inspection
Dual vision system for precise pos
