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LASER applications
Semi-conductor
PCB/FPC
Other
DISPENSING applications
AOI applications
SI & AUTOMATION applications
Laser Marking
Laser Cleaning
Laser Cutting
Laser Grooving
Laser Bonding
2300LC HTCC/LTCC
Ceramic Laser Cutting Equipment
Cencorp 2300LC is mainly used for laser scribing, cutting and drilling of Al2O3， AlN and other ceramic materials.
