Cencorp 1200AW is used for surface macro defect inspection of wafer and substrate/post die bonding during the semi-conductor assembly and test stage. It supports automatic loading and unloading of 8-inch/12-inch wafer and substrate/post die bonding device, and is manually compatible with surface macro defect inspection of 12-inch wafer after dicing and single chip.

Optoelectric chip 4-sides inspection & sorting equipment (1500AD) is used to detect the appearance defects of optoelectronic chips. The whole system supports complex defect detection of different types; Through the visual and micro-motion mechanism to automatically complete the chip positioning, the thimble + nozzle design to ensure the rapid and stable stripping of chips; Precision machinery high-speed motion control, high-speed autofocus of optical system; It also supports high-precision image acquisition of the front of the product and the two luminous surfaces; 2-up mode, separate the porter station from the test station, improve the equipment production capacity; Mechanical modular design, for different products of customers, can achieve quick disassembly and switching; Data will be saved to the database, customers can be very convenient to query, can provide MES interface support; Automatic alarms and notifications to help operators deal with problems.

Cencorp 1700 LC is a fully automatic laser wafer dicing machine suitable for applications such as Si-based wafer dicing, sapphire surface grooving, and Low-K layer grooving. The equipment is equipped with wafer coating system, laser dicing system, cleaning system, transferring system and loading & unloading system, which can greatly reduce the waiting time and improve the efficiency of the whole machine. Modular design, compatible with hardware switching of wafer stealth dicing, efficient and convenient optical path debugging and maintenance. Support 8-inch and 12-inch wafers, automatic focus, fully automatic production.

Cencorp 2400 CH is used for high-speed pick and place of optoelectronic chips, integrated circuits, and MEMS sensor chips in the final test stage.