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LASER applications
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DISPENSING applications AOI applications SI & AUTOMATION applications
  • Micro-hole Processing
  • Glue Removal
  • 700LC
    Medical Device Laser Glue Removal Equipment
    Cencorp 700 LC is mainly used to remove excess glue in some parts of medical device products after bonding. It can effectively remove various types of excess glue such as epoxy resin and UV glue, without damaging the medical device itself. When used in conjunction with dust removal equipment, it ensures no residue and can effectively improve the quality of medical device products.
  • 1200LD
    Medical Device Laser Drilling Equipment
    Cencorp 1200 LD is mainly used for laser drilling of non-metallic medical catheters, with a minimum aperture of 50 μ m. It is suitable for medical catheters made of various materials such as FEP and PU. Laser drilling does not produce burrs or residues, and the aperture can be flexibly controlled according to needs, ensuring safety and pollution-free.
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