Product Description
Cencorp 700 LC is mainly used to remove excess glue in some parts of medical device products after bonding. It can effectively remove various types of excess glue such as epoxy resin and UV glue, without damaging the medical device itself. When used in conjunction with dust removal equipment, it ensures no residue and can effectively improve the quality of medical device products.
Advantages
Flexibility
The standard configuration uses CO2 far-infrared wavelength laser, which has good beam quality and is insensitive to metal materials, so it will not cause damage to the product itself;
Different power lasers can be configured according to diff
