Cencorp 1200AW is used for surface macro defect inspection of wafer and substrate/post die bonding during the semi-conductor assembly and test stage. It supports automatic loading and unloading of 8-inch/12-inch wafer and substrate/post die bonding device, and is manually compatible with surface macro defect inspection of 12-inch wafer after dicing and single chip.

Optoelectric chip 4-sides inspection & sorting equipment (1500AD) is used to detect the appearance defects of optoelectronic chips. The whole system supports complex defect detection of different types; Through the visual and micro-motion mechanism to automatically complete the chip positioning, the thimble + nozzle design to ensure the rapid and stable stripping of chips; Precision machinery high-speed motion control, high-speed autofocus of optical system; It also supports high-precision image acquisition of the front of the product and the two luminous surfaces; 2-up mode, separate the porter station from the test station, improve the equipment production capacity; Mechanical modular design, for different products of customers, can achieve quick disassembly and switching; Data will be saved to the database, customers can be very convenient to query, can provide MES interface support; Automatic alarms and notifications to help operators deal with problems.

Cencorp 1700 LC is a fully automatic laser wafer dicing machine suitable for applications such as Si-based wafer dicing, sapphire surface grooving, and Low-K layer grooving. The equipment is equipped with wafer coating system, laser dicing system, cleaning system, transferring system and loading & unloading system, which can greatly reduce the waiting time and improve the efficiency of the whole machine. Modular design, compatible with hardware switching of wafer stealth dicing, efficient and convenient optical path debugging and maintenance. Support 8-inch and 12-inch wafers, automatic focus, fully automatic production.

Cencorp 1400LS is mainly used for the soldering process of pre solder paste for electronic components, suitable for surface mount and perforated parts. With temperature control modules, the soldering process is more stable and the soldering quality is better.

Laser Router Machine: Cencorp 900 LD is mainly used in the FPCB and PCB industries, providing users with simple, fast, consumable free, non-contact, high-precision cutting solutions of any shape. The maximum product processing size can reach 400 * 350mm

UV laser drilling equipment is mainly used for FPC and RF drilling (through-hole/blind hole); FPC window opening; FPC/RF and auxiliary material cutting; RF opening and other process steps.

1000LM PCB is a laser marking equipment developed for the electronic circuit industry to achieve rapid marking process. This PCB laser marking equipment can be used for different marking needs, and a dual laser structure can be selected to achieve simultaneous marking on both sides of the product.

1000LM PCB is a laser marking equipment developed for the electronic circuit industry to achieve rapid marking process. This PCB laser marking equipment can be used for different marking needs, and a dual laser structure can be selected to achieve simultaneous marking on both sides of the product.

The equipment is mainly used for PCB and FPC industry. It is designed for marking SUS reinforcing steel sheet, ink layer and solder mask layer on all kinds of FPC/PCB. It is designed with two slots to increase the productivity, and could cover product size up to 260*420mm.

Cencorp 700 LMC EVO laser marking cell is a solution with most cost-effective. It can meet various marking and ablation needs through flexible configuration. cencorp 700 LMC can laser mark both sides of product through a flipping unit to ensure the production capacity.

Cencorp 1000LWS is mainly used in the power semiconductor industry and can perform laser welding on different sizes of power semiconductor devices, such as IGBT and MOSFET device terminals and ceramic substrates, with good consistency in welding appearance and penetration depth.

Cencorp 1700 LC is a fully automatic wafer laser dicing machine suitable for applications such as Si-based wafer dicing, sapphire surface grooving, and Low-K layer grooving. The equipment is equipped with wafer coating system, laser dicing system, cleaning system, transferring system and loading & unloading system, which can greatly reduce the waiting time and improve the efficiency of the whole machine. Modular design, Included first knife detection, scratch detection functional modules. Support 8-inch and 12-inch wafers, automatic focus, fully automatic production.