Cencorp 700 LC is mainly used to remove excess glue in some parts of medical device products after bonding. It can effectively remove various types of excess glue such as epoxy resin and UV glue, without damaging the medical device itself. When used in conjunction with dust removal equipment, it ensures no residue and can effectively improve the quality of medical device products.

Cencorp 1200 LD is mainly used for laser drilling of non-metallic medical catheters, with a minimum aperture of 50 μ m. It is suitable for medical catheters made of various materials such as FEP and PU. Laser drilling does not produce burrs or residues, and the aperture can be flexibly controlled according to needs, ensuring safety and pollution-free.

Cencorp 1400LS is mainly used for the soldering process of pre solder paste for electronic components, suitable for surface mount and perforated parts. With temperature control modules, the soldering process is more stable and the soldering quality is better.

Laser Router Machine: Cencorp 900 LD is mainly used in the FPCB and PCB industries, providing users with simple, fast, consumable free, non-contact, high-precision cutting solutions of any shape. The maximum product processing size can reach 400 * 350mm

UV laser drilling equipment is mainly used for FPC and RF drilling (through-hole/blind hole); FPC window opening; FPC/RF and auxiliary material cutting; RF opening and other process steps.

1000LM PCB is a laser marking equipment developed for the electronic circuit industry to achieve rapid marking process. This PCB laser marking equipment can be used for different marking needs, and a dual laser structure can be selected to achieve simultaneous marking on both sides of the product.

1000LM PCB is a laser marking equipment developed for the electronic circuit industry to achieve rapid marking process. This PCB laser marking equipment can be used for different marking needs, and a dual laser structure can be selected to achieve simultaneous marking on both sides of the product.

The equipment is mainly used for PCB and FPC industry. It is designed for marking SUS reinforcing steel sheet, ink layer and solder mask layer on all kinds of FPC/PCB. It is designed with two slots to increase the productivity, and could cover product size up to 260*420mm.

Cencorp 700 LMC EVO laser marking cell is a solution with most cost-effective. It can meet various marking and ablation needs through flexible configuration. cencorp 700 LMC can laser mark both sides of product through a flipping unit to ensure the production capacity.

Cencorp 1000LWS is mainly used in the power semiconductor industry and can perform laser welding on different sizes of power semiconductor devices, such as IGBT and MOSFET device terminals and ceramic substrates, with good consistency in welding appearance and penetration depth.

Cencorp 1700 LC is a fully automatic wafer laser dicing machine suitable for applications such as Si-based wafer dicing, sapphire surface grooving, and Low-K layer grooving. The equipment is equipped with wafer coating system, laser dicing system, cleaning system, transferring system and loading & unloading system, which can greatly reduce the waiting time and improve the efficiency of the whole machine. Modular design, Included first knife detection, scratch detection functional modules. Support 8-inch and 12-inch wafers, automatic focus, fully automatic production.

Cencorp 2300LC is mainly used for laser scribing, cutting and drilling of Al2O3， AlN and other ceramic materials.