Cencorp 1700 LC is a fully automatic wafer laser dicing machine suitable for applications such as Si-based wafer dicing, sapphire surface grooving, and Low-K layer grooving.
The equipment is equipped with wafer coating system, laser dicing system, cleaning system, transferring system and loading & unloading system, which can greatly reduce the waiting time and improve the efficiency of the whole machine.
Modular design, Included first knife detection, scratch detection functional modules.
Support 8-inch and 12-inch wafers, automatic focus, fully automatic production.