Wafer appearance defect inspection equipment is used for appearance defect inspection of wafers before and after cutting.

Cencorp 1200AW is used for surface macro defect inspection of wafer and substrate/post die bonding during the semi-conductor assembly and test stage. It supports automatic loading and unloading of 8-inch/12-inch wafer and substrate/post die bonding device, and is manually compatible with surface macro defect inspection of 12-inch wafer after dicing and single chip.