Cencorp 1700 LC is a fully automatic laser wafer dicing machine suitable for applications such as Si-based wafer dicing, sapphire surface grooving, and Low-K layer grooving. The equipment is equipped with wafer coating system, laser dicing system, cleaning system, transferring system and loading & unloading system, which can greatly reduce the waiting time and improve the efficiency of the whole machine. Modular design, compatible with hardware switching of wafer stealth dicing, efficient and convenient optical path debugging and maintenance. Support 8-inch and 12-inch wafers, automatic focus, fully automatic production.